RTM用中温固化环氧树脂基体的研究  

Study on the moderate temperature curing epoxy matrix for resin transfer molding

作　　者：苏曹宁[1] 范广宏[1] 陈蕴博[1] 

机构地区：[1]机械科学研究总院先进制造技术研究中心,北京100083

出　　处：《热固性树脂》2014年第2期14-17,21,共5页Thermosetting Resin

基　　金：机械科学研究总院先进制造技术研究中心基金(CAMTC 211013)资助

摘　　要：在双酚F树脂中分别加入不同质量的711和TDE-85环氧树脂制备了6种环氧树脂体系,并采用聚醚胺和脂环胺复合固化剂固化,对各体系的粘度、固化行为、耐热性及力学性能进行了测试。结果表明,711环氧树脂具有比TDE-85更高的反应活性。在80 g双酚F树脂中加入20 g TDE-85环氧制备的体系具有最佳的综合性能,30℃下的适用期(粘度<500 mPa·s)为120 min,玻璃化转变温度102℃,常温下固化物拉伸强度为78.6 MPa,有望用于多种复合材料的RTM成型。The six kinds of epoxy resins were prepared by adding different amounts of TDE - 85 and 711 epoxy res- ins to bisphenol F resin and and cured with complex curing agent of polyether amine and alicyclic amine. The vis- cosity, curing behavior , heat resistance and mechanical properties of the systems were tested. The results showed that the 711 epoxy resin had higher reactivity than that of TDE - 85 resins. The system of bisphenol F resin 80 g and TDE - 85 20 g had the best overall performance and was expected to be used for the fabrication of a variety of composites by RTM molding. The pot life at 30℃ （viscosity less than 500 mPa·s ）, glass transition temperature and tensile strength at room temperature of the system was 120 min, 102℃ and 78.6 MPa, respectively.

关 键 词：双酚F环氧树脂 TDE-85环氧树脂 树脂传递模塑 中温固化 粘度 拉伸强度 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]