一种IGBT接触热阻的估算方法  

An Estimation Method of Thermal Contact Resistance of IGBT

作　　者：王淑旺[1] 胡俊明[1] 赵卫健[1] 孙纯哲 

机构地区：[1]合肥工业大学,合肥230009 [2]安徽巨一自动化装备有限公司,合肥230009

出　　处：《微特电机》2014年第3期42-44,共3页Small & Special Electrical Machines

基　　金：2010高等学校博士学科点专项科研基金(201021021 10001);国家科技重大专项(2012ZX04001-011-003);辽宁省省科技厅重点项目(2011020112-401)

摘　　要：电动汽车电机控制器的关键模块IGBT由于集成度高、发热量大,容易烧毁,亟需对其散热结构进行仿真分析与结构优化。对IGBT散热结构的仿真分析,必须先确定所需的几何物理边界条件和热物性边界条件,其中IGBT与散热器之间的接触热阻是关键的参数之一。但接触面的导热硅脂涂层的热特性及IGBT模块与散热器的接触情况并不明确,为此建立了黑匣子模型,采用黑匣子逼近试算的热仿真分析方法,通过实验和FLUENT软件热仿真对比的手段成功地估算出了黑匣子的导热系数,并进一步验证了估算得到的接触热阻的合理性,为以后的仿真和优化分析奠定了基础。The most important key module of motor controller in electric vehicle is IGBT,which is easily to burn due to its high integration level and calorific capacity.So it is necessary to make simulation analysis and structure optimization for the heat dissipation structure.In order to make simulation analysis of IGBT radiating structure,first the geometric physical and thermo physical properties boundary condition must be determined,and the thermal contact resistance between IGBT and radiator is one of the key parameters.But the thermal characteristics of thermally conductive silicone on the contact surface and the contact condition between IGBT and radiator contact is not clear.Therefore a black box model was established,and by means of contrast between the experiment and Fluent software thermal simulation,the coefficient of thermal conductivity of the black box was estimated.Then the rational estimation of thermal contact was verified,thus lay the foundation of further study on simulation and optimization analysis was laid.

关 键 词：热仿真 IGBT模块 接触热阻 FLUENT软件 

分 类 号：TM464[电气工程—电器]