LED封装用导电银胶的研制  

Study on Conductive Silver Adhesive for LED Encapsulation

作　　者：牟秋红[1,2] 琚伟[1,2] 彭丹[1,2] 刘月涛[1,2] 李金辉[1,2] 张敏[1] 

机构地区：[1]山东省科学院新材料研究所,山东济南250014 [2]山东省粘接材料重点实验室,山东济南250014

出　　处：《世界橡胶工业》2014年第3期39-41,共3页World Rubber Industry

基　　金：山东省优秀中青年科学家科研奖励基金项目(BS2012CL031)

摘　　要：以环氧树脂为主要成分,配合以平均粒径为0.2μm的片状银粉、聚酰胺酰亚胺预聚体,加入适当的潜伏型固化剂、促进剂、稀释剂、偶联剂等,制备了高性能LED用导电银胶。该导电银胶为单组分,常温贮存,剪切强度为17.8 MPa(室温)和5.34 MPa(150℃),体积电阻率1x10-5Ω·cm。High pertformance silver adhesive for LED encapsulation were prepared using epoxy resin, composed with flake silver powder whose average particle size was 0.2μm,curing agent, latent curing agent, accelerator, diluent, coupling agent,and so on The conductive silver adhesive was one part and room temperature storage. The shear strength were 17.8 MPa （room temperature） and 5.34 MPa （ 150 ℃） and the volume resistivity was 1×10^-5Ω·cm.

关 键 词：导电银胶 LED 体积电阻率 耐热性 

分 类 号：TQ437.6[化学工程]