微波组件壳体激光焊接技术的研究  

Research on laser welding technology for microwave modules

作　　者：朱玮涛[1] 张海兵[1] 吴苏兴[1] 邝小乐 

机构地区：[1]中国船舶重工集团公司第七二四研究所,南京211153

出　　处：《雷达与对抗》2014年第1期53-57,共5页Radar & ECM

摘　　要：结合微波T/R组件更小、更轻、更可靠的发展方向,对微波组件壳体材质、气密性焊接技术进行了分析,重点讨论了激光焊接密封的关键技术,并通过铝合金壳体的激光焊接试验对影响铝合金焊接质量的因素进行了研究。The materials of microwave modules and the hermetical welding technology are analyzed in combination with the development requirements of smaller, lighter and more reliable microwave T/R modules, with an emphasis on the key technologies of laser sealed welding. In addition, the factors that influence the welding quality of the aluminum alloys are studied through the laser welding test of the aluminum alloys.

关 键 词：微波组件 铝合金 激光焊接 

分 类 号：TG456.7[金属学及工艺—焊接]