焦磷酸盐溶液体系电沉积铜及铜–锡合金的电化学行为  

Electrochemical behaviors of copper and copper–tin alloy electrodeposition from aqueous pyrophosphate electrolyte

作　　者：黄灵飞 曾振欧[1] 冯冰 谢金平 李树泉 

机构地区：[1]华南理工大学化学与化工学院,广东广州510640 [2]广东致卓精密金属科技有限公司,广东佛山528247

出　　处：《电镀与涂饰》2014年第7期275-278,共4页Electroplating & Finishing

摘　　要：采用电化学测试方法研究了焦磷酸盐溶液体系在铜电极表面电沉积Cu及Cu–Sn合金(低Sn)的电化学行为。探讨了添加剂JZ-1对电沉积Cu和Cu–Sn合金的影响,并对电沉积层的表面形貌和晶相结构进行分析。结果表明,焦磷酸盐溶液体系电沉积Cu及Cu–Sn合金均为不可逆电极过程,发生电化学极化。电沉积Cu的阴极过程表现为前置转化反应很快和以CuP22 O-7直接还原的反应机理形式。电沉积Cu–Sn合金过程中Cu与Sn之间存在相互作用,溶液中的Cu2+与Sn2+也存在相互促进电沉积的作用,Cu–Sn合金的晶相结构为Cu13.7Sn。添加剂JZ-1具有促进Cu电沉积和抑制Sn电沉积的双重作用,有利于降低Cu–Sn合金中的Sn含量并细化晶粒。The electrochemical behaviors of Cu and low-Sn Cu-Sn alloy electrodeposition on copper electrode from aqueous pyrophosphate bath were studied by electrochemical test methods. The effect of additive JZ-1 on Cu and Cu-Sn alloy electrodeposition was discussed and the surface morphologies and crystal structures of electrodeposited coatings were analyzed. The results showed that both Cu and Cu-Sn alloy electrodeposition from aqueous pyrophosphate bath are irreversible electrode process, during which electrochemical polarization happens. It was considered that the reaction mechanism of the cathodic process of Cu electrodeposition consists of fast preceding chemical transformation step and direct reduction of CuP20：7-. There is interaction between Cu and Sn during Cu-Sn alloy electrodeposition process, as well as mutual promotion between Cu2＋ and Sn2＋ in electrodeposition. The crystal structure of Cu-Sn alloy is CUl3.7Sn. The additive JZ-1 has a dual role of promoting Cu electrodeposition and inhibiting Sn electrodeposition, which is benefit for the reduction of Sn content in Cu-Sn alloy and grain refinement.

关 键 词：铜 铜-锡合金 电沉积 焦磷酸盐 添加剂 电化学 

分 类 号：TQ153.2[化学工程—电化学工业] TQ153.14