引起阻焊膜色差的关键因素分析  

Study on the key factors of color difference of solder mask

作　　者：曾娟娟 陈黎阳 乔书晓 

机构地区：[1]广州兴森快捷电路科技有限公司,广东广州510730

出　　处：《印制电路信息》2014年第4期9-14,共6页Printed Circuit Information

摘　　要：在PCB阻焊外观品质控制中,阻焊的颜色是比较重要的一项控制点,对于使用同一型号阻焊油墨的一款生产板,板面阻焊出现明显的色差,客户一般不接受,目前业内对于引起阻焊色差的深层原因罕见报道。本文主要针对阻焊色差问题,研究了阻焊厚度、预烘时间、曝光能量、热固化温度时间等对阻焊颜色的影响,尝试从光学角度和阻焊的微观结构来解释引起阻焊色差的根本原因,同时研究了阻焊膜的色差所带来的可靠性问题,从结合力和其耐化学性方面做深入探讨。The color of solder mask is an important control point of the appearance quality of PCB. When PCBs of the same type using a certain type of liquid photosensitive ink show significant color differences, it’s generally not received for consumer. However, the underlying reason causing color difference of solder mask has not been reported. This paper mainly aims at color difference of solder mask, in-depth study the effects of thickness of solder mask, pre-baking time, exposure energy and the temperature and time of curing on the color of solder mask, trying to explain the underlying reason causing color difference of solder mask from the optical point of view and the microstructure of solder mask. At the same time, the inlfuence of color difference of solder mask on the binding force between solder mask and board and the chemical resistance of solder mask were studied in this paper.

关 键 词：阻焊 色差 结合力 耐化学性 

分 类 号：TN41[电子电信—微电子学与固体电子学]