盲埋孔结构多层厚铜印制板工艺的研究  

Study on the process of multilayer thick copper board with blind and buried via structure

作　　者：黄镇[1] 

机构地区：[1]天津普林电路股份有限公司,天津300308

出　　处：《印制电路信息》2014年第4期165-168,共4页Printed Circuit Information

摘　　要：以一典型含有复杂盲埋孔结构的多层(18L)厚铜PCB产品的工艺制造过程为主线,较详细的介绍了产品结构设计、主要工艺过程以及厚铜压合、层间对位等难点工艺的应对问题,并最终通过实际实验及分析得出较适用的工艺方法,为此类产品的加工提供了很好的指导意义。This article is based upon a typical multilayer（18 Layer） thick copper PCB production, which is with bilnd and buried Via structure, it particular introduced the design and main process of the production, also the press of thick copper and lanmination method for this special structure. And ifnally based on the analysis of actual experiment, it raised some proposal which is more suitable for the special structure, provided good guidance signiifcance to the manufaction.

关 键 词：多层压合 厚铜 盲埋孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]