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作 者:闫翔宇[1] 袁颖[1] 吴开拓[1] 崔毓仁[1]
机构地区:[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054
出 处:《压电与声光》2014年第2期270-274,共5页Piezoelectrics & Acoustooptics
基 金:中央高校基本科研业务费专项基金资助项目(ZYGX2012J035)
摘 要:采用湿法工艺,并通过马弗炉烧结与热压烧结,制备了SiO2与TiO2共同填充的聚四氟乙烯(PTFE)复合材料。系统研究了两种填料不同掺杂比及不同烧结工艺对复合材料密度、显微结构、介电性能和热膨胀性能的影响。结果表明,与马弗炉烧结相比,热压烧结工艺制备的复合材料具有更稳定的密度和较小的吸水率,但介电损耗较高;ROM和Kerner模型能较好地对线膨胀系数进行预测,其理论值与实验值的变化规律一致。对于用2种烧结方法制备的复合材料,通过Lichtenecker对数法则计算所得介电常数与实验值均较吻合。PTFE composites filled with SiO2 and TiO2 were prepared through wet process and sintered by Muffle furnace and Hot-pressing. The density, microstructure, dielectric properties and thermal expansion of the composite materials doped with different ratios of these two ceramics and sintered by different methods were systematically in- vestigated. The experimental results show that the composites prepared by hot-pressing process exhibit better sta- bility in density, low water absorption and relatively higher dielectric loss compared with the samples sintered by Muffle furnace. The ROM and Kerner models can be used to predict the coefficient of thermal expansion of compos- ites, and the theoretical values predicted by these two models match well with the experimental values. The dielec- tric constants of the composites calculated by Lichtenecker module also match well with the experimental values for both sintering methods.
关 键 词:复合材料 聚四氟乙烯(PTFE) TIO2 SIO2 热压烧结 马弗炉烧结
分 类 号:TB332[一般工业技术—材料科学与工程]
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