Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication  

作　　者：XU Ke TIAN XiaoJun YU HaiBo YANG Yang ZHOU Lei LIU LianQing 

机构地区：[1]State Key Laboratory of Robotics,Shenyang Institute of Automation, Chinese Academy of Sciences [2]Information & Control Engineering Faculty, Shenyang Jianzhu University

出　　处：《Science China(Technological Sciences)》2014年第4期734-737,共4页中国科学（技术科学英文版）

基　　金：supported by the National Natural Science Foundation of China(Grant No.51005230);China Postdoctoral Science Foundation(Grant No.2012M520654);the Education Department of Liaoning Province Science and Ttechnology Research Projects(Grant No.L2012213)

摘　　要：To improve the efficiency of nano-electronic device fabrication, a new method named floating electrical potential assembly is proposed to realize large-scale assembly of Cu/CuO nanowires, The simulation of floating electrical potential distribution on the micro-electrode chip is performed by COMSOL software, and the simulation result shows that the coupled electrical poten- tial on the floating drain electrodes is very close to the original electrical potential applied on the gate electrode, whicb means that the method can provide di-electrophoresis （DEP） force for all the electrode pairs at one time, thus realizing large-scale as- sembly at one time. With Cu/CuO nanowires well dispersed and micro-electrode chip fabrication, nanowires assembly experiments are performed and the experimental results show that Cu/CuO nanowires are assembled at hundreds of micro-electrodes pairs at one time, and the success rate of nanowires assembly also reaches 90%.

关 键 词：large-scale assembly Cu/CuO nanowires floating potential di-electrophoresis 

分 类 号：TP242[自动化与计算机技术—检测技术与自动化装置]