电镀锡板木纹缺陷的形成原因及解决措施  

Cause and Solution of Wood Grain Defects on Tinplate

作　　者：金旭芳[1] 吴小兵[1] 霍大维[1] 王欣[1] 许随馨 

机构地区：[1]北京机械工业自动化研究所,北京100120

出　　处：《中国冶金》2014年第1期23-25,共3页China Metallurgy

摘　　要：探讨了电镀锡带钢在软熔工艺段采用工频电阻软熔时形成木纹缺陷的原因，提出了消除木纹缺陷的新技术——变频电阻软熔。它通过改变软熔电源的频率（50～200Hz）能消除木纹缺陷，不同工艺条件下，消除木纹缺陷所需要的电源最低频率值不同。详细介绍了该技术在400m／min电镀锡线上的应用情况。与普遍采用的工频电阻加高频感应的组合软熔工艺相比，该技术既提高了用电效率，也提高了电镀锡板表面的抗划伤性，尤其适合高速电镀锡线。The cause for wood grain defect on tinplate strip during power frequency resistance reflow is applied are discussed, and a new technique for eliminating the defect is presented. Variable frequency resistance reflow can eliminate wood grain defect by adjusting reflow power supply frequency from 50 Hz to 200 Hz. In different process conditions, the minimum power supply frequency for eliminating the defect varies. The application of variable fre- quency resistance reflow in 400 m/min electrotinplate production line is introduced in detail. Comparing with the currently used combination reflow of power frequency resistance reflow and high frequency induction reflow, the new technique increases not only power supply efficiency, but also scratch resistance of tinplate. It is especially suitable for high speed electrotinplate production line.

关 键 词：电镀锡板 木纹 感应软熔 变频电阻软熔 

分 类 号：TQ153[化学工程—电化学工业]