电流密度对Ni-TiN镀层微观组织及性能的影响  

Effect of current density on microstructure and performance of Ni-TiN coatings

作　　者：户志宇 郑涛[1] 张磊[1] 刘超[2] 战中学[3] 

机构地区：[1]东北石油大学机械科学与工程学院,黑龙江大庆163318 [2]东北石油大学电子科学学院,黑龙江大庆163318 [3]中国兵器科学研究院宁波分院,内蒙古包头014034

出　　处：《兵器材料科学与工程》2014年第2期92-94,共3页Ordnance Material Science and Engineering

摘　　要：在45钢表面脉冲电沉积Ni-TiN镀层。利用原子吸收分光光度计（AAS）、扫描电镜（SEM）和显微硬度计研究电流密度对Ni-TiN镀层TiN粒子含量、微观组织及显微硬度的影响。结果表明：随着电流密度的增加，镀层中TiN粒子的含量先增大后减少；当电流密度为7A／dm3,TiN粒子含量达到最大值，为9．89％；电流密度为5～7A／dm2，随着电流密度的增加，Ni-TiN镀层表面颗粒逐渐细化。Ni-TiN镀层的显微硬度随着电流密度的增大先增加后降低，电流密度为7A／din。时显微硬度达到最大值，为844．5HV。Ni-TiN coatings were prepared on 45 steel by pulse electrodepositing method. The effect of current density on the content of TiN particle, morphology and microhardness of Ni-TiNcoatings were studied by atomic absorption spectrophotometer （AAS） , scanning electron microscope （SEM） and microhardness tester. The results show that TiN particles content in the coating firstly increases and then decreases with the increase of current density. When the current density is 7 A/dm2, the TiN content reaches 9,89%. As for the current density of 5-7 A/dm2, the surface particle is gradually becoming finer with the increase of current density. The microhardness of the coatings firstly increases and then decreases with the increase of current density, and when the current density is 7 A/dm2, the microhardness reaches 844.5HV.

关 键 词：电流密度 Ni-TiN镀层 影响 

分 类 号：TG153.43[金属学及工艺—热处理]