用Cu^(2+)印迹凹土/壳聚糖复合材料纯化低品位铜矿中的铜  

Purification of copper from low grade copper ores with Cu^(2+) ions-imprinted attapulgite/chitosan composite materials

作　　者：石莹莹[1] 张强华[1] 陈静[1] 熊清平[1] 吴飞[1] 肖丽静 

机构地区：[1]淮阴工学院生命科学与化学工程学院江苏省凹土资源利用重点实验室,淮安223003

出　　处：《中国有色金属学报》2014年第3期801-807,共7页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(51174096);淮安市工业支撑项目(HAG2010011)

摘　　要：利用Cu2+印迹凹土/壳聚糖复合材料(Cu2+ions-imprinted attapulgite/chitosan composite materials,Cu2+-IICA)富集和纯化低品位铜矿中的铜,将低品位铜矿粉碎后用1 moL/L盐酸搅拌浸泡24 h,浸出液中铜用Cu2+-IICA进行分离和纯化,采用单因素实验设计法优化筛选Cu2+-IICA纯化铜的最佳静态吸附-解析和动态吸附-解析工艺条件。结果表明,Cu2+-IICA纯化铜的静态吸附-解析最佳条件为Cu2+的初始浓度20.00 mg/mL、吸附温度25℃、pH值5.0,解析液6%HNO3(质量分数)溶液;动态吸附-解析最佳条件为上样液流速40.0 mL/h、上样液体积60.0mL、解析剂用量150 mL、解析剂流速60.0 mL/h。在最优条件下Cu2+-IICA对铜具有良好的选择性和吸附性能,矿石经Cu2+-IICA分离纯化后,铜含量由纯化前的8.06%增大到纯化后的92.78%,提高了11.5倍。The enrichment and purification of copper from acid leaching solution of low grade copper ore by Cu2＋ ions-imprinted attapulgite/chitosan composite materials （Cu2＋-IICA） were studied. The copper ore was soaked by 1 moL/L HCl for 24 h, and single factor test method was used to optimize the technological conditions of enrichment and the purification of copper by static and dynamic adsorption-desorption experiments. The results show that the optimum technological conditions of static adsorption-desorption experiments are as follows： the initial concentration of Cu2＋ is 20.00 mg/mL, adsorption temperature is 25 ℃, pH value is 5.0, and eluent solution is 6% HNO3 （mass fraction） solution. The optimum technological conditions of dynamic adsorption-desorption experiments are as follows： the flow rate of sample solutions is 40.0 mL/h, the sample volume is 60.0 mL, the flow rate and the dosage of eluent solutions are 60.0 mL/h and 150 mL, respectively. Cu2＋-IICA has good selectivity and adsorption properties to copper under the optimal conditions, and the copper content increases from 8.06% to 92.78% after purification, increased by as much as 11.5 times.

关 键 词：凹土 壳聚糖 离子印迹 低品位铜矿 纯化 

分 类 号：TF804.3[冶金工程—有色金属冶金]