有机硅改性环氧树脂及其室温固化的性能研究  

Performance of silicone modified epoxy resin curable at room temperature

作　　者：夏兰君[1] 李福志 熊和建[1] 管蓉[1] 鲁德平[1] 

机构地区：[1]湖北大学化学化工学院,湖北武汉430062 [2]武汉粘接学会,湖北武汉430062

出　　处：《粘接》2014年第4期54-57,共4页Adhesion

摘　　要：采用二苯基硅二醇(DSPD)改性双酚A型环氧树脂(E-51)制备了有机硅改性的环氧树脂,采用硫脲改性聚酰胺650制备了室温快速固化的环氧固化剂。合成产物通过红外进行表征,用盐酸-丙酮法测定改性环氧树脂的环氧值,通过指干时间确定聚酰胺650和改性聚酰胺650与E-51的较优配比。通过差示扫描量热分析法(DSC)和热重分析法(TG)表征改性环氧树脂固化物的耐热性,通过拉伸性能和扫描电镜测试(SEM)表征改性环氧树脂固化物的韧性。实验结果表明,环氧树脂经改性后,其玻璃化温度升高了27℃,与聚酰胺650固化后,固化产物的起始热分解温度明显增加,失重50%的分解温度升高了180℃,固化物的断裂伸长率增加了3.41%,断裂面呈现明显韧性断裂特征。The silicone modified epoxy resin was synthesized by the reaction ofa bisphenol A type resin epoxy （E- 51） and dihydroxydiphenylsilane （DSPD）,a room-temperature and quick curing agent was prepared from polyamide 650 modified with thiourea.The products were tested by IR spectroscopy, the epoxide number of the modified epoxy resin was determined by the hydrochloric acid-acetone method, and the optimum ratio ofpolyamide 650 and modified polyamide 650 to epoxy resin E-51 was determined by tack free time.The heat resistance of the cured products of modified epoxy resin was characterized by differential scanning calorimetry analysis （DSC） and thermal gravimetric analysis （TG）.Moreover,the toughness of the cured products of modified epoxy resin was characterized by tensile test and scanning electron microscopy （SEM）.The experimental results showed that the glass transition temperature （Tg） of modified epoxy resin was increased by 27℃ ,the onset temperature of weight loss was increased obviously after curing with polyamide 650,the thermal decomposition temperature for 50% weight loss was 150℃ higher than that of the unmodified epoxy resin,the elongation at break of the cured product increased by 3.41%,in addition,the fracture surface showed obviously the ductile fracture characteristics from SEM images.

关 键 词：环氧树脂 二苯基硅二醇(DSPD) 室温固化 

分 类 号：TQ433.43[化学工程]