SiC_p/Al-30Si复合材料的界面反应机理  

Interface reaction mechanism of SiC reinforced Al-30Sialloy composites

作　　者：兖利鹏[1] 王爱琴[1] 谢敬佩[1] 王行[1] 

机构地区：[1]河南科技大学材料科学与工程学院

出　　处：《粉末冶金材料科学与工程》2014年第2期191-196,共6页Materials Science and Engineering of Powder Metallurgy

基　　金：国家自然科学基金资助项目(51371077)

摘　　要：利用真空热压法制备25SiCp/Al-30Si复合材料，采用SEM、TEM对SiCp、Sip与基体结合界面及微观组织进行表征，采用XRD分析材料的物相组成。从热力学、界面化学反应及界面润湿原理计算解释SiCp、Sip与基体的结合界面特征。结果表明，Sip/Al界面清晰、平直，表明该界面结合良好，SiC及Si未与基体发生反应。SiC与Al具有如下的匹配关系：[011]SiC//[011]Al（约差1°～2°），（111）SiC//（111）Al ，（022）SiC//（022）Al ，Al与SiC在{111}、（022）晶面上形成半共格相界。SiCp/Al-30Si composite was fabricated by vacuum hot-pressing sintering. Interfacial characteristics in the SiCp/Al-30Si composite were investigated using SEM、TEM、XRD, Which were calculated and explained by theoretical thermodynamic model, interface chemical reaction and wetting principle. The results show that the edges of SiC and Si are observed to be clean and sharp, indicating that no interfacial reactions have occurred. Three types of different orientation relationships are observed between the β-SiC and Al phase, with the SiC [011] parallel to the Al [011]、（111）SiC//（111）Al and （022）SiC//（022）Al , where a good semicoherent bonding exists between them.

关 键 词：真空热压烧结 热力学 界面 

分 类 号：TB331[一般工业技术—材料科学与工程]