固态组件材料和结构参数对热阻的影响  

Effect of Material and Structure Parameters on Thermal Resistance of Solid State Module

作　　者：李金旺[1] 钱吉裕[1] 

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2014年第2期19-22,共4页Electro-Mechanical Engineering

摘　　要：研究了热流密度为100 W/cm2的固态组件的基板和壳体的等效导热系数、厚度和横截面面积对整个组件的冷却装置的热阻的影响。基板和壳体的导热系数从160 W/(m·K)提高到800 W/(m·K)时,冷却装置总热阻分别下降约1.2℃/W和0.55℃/W,下降比例分别为33.3%和15.5%;基板厚度从0.4 mm增加到1.6 mm时,冷却装置总热阻下降约0.78℃/W,下降比例为22.0%;基板横截面面积从0.42 cm2增加到2.1 cm2时,冷却装置总热阻下降约0.52℃/W,下降比例为15.1%;壳体厚度从0.8 mm增加到2.4 mm时,冷却装置总热阻下降约0.43℃/W,下降比例为11.6%;以上各种情况中冷却装置总热阻下降趋势为先急后缓。对于目前的组件而言,参考上述结果进行优化,将使组件的冷却得到明显改善。The effect of equivalent thermal conductivity, thickness and cross-sectional area of the base and the shell of solid state module （ heat flux is 100 W/cm2 ） on the thermal resistance of the cooling device of the module is studied in this paper. The thermal resistance of the cooling device reduces about 1.2 ℃/W and 0.55℃/W when the thermal conductivity of the base and the shell increase from 160 W/（m @ K） to 800 W/（m @ K） respectively, and the reducing percentage is 33.3% and 15.5% respectively. The ther- mal resistance of the cooling device reduces about 0.78 ℃/W when the thickness of the base increases from 0.4 mm to 1.6 mm, and the reducing percentage is 22.0%. The thermal resistance of the cooling device reduces about 0.52℃/W when the cross-sectional area of the base increases from 0.42 cm2 to 2.1 cm2, and the reducing percentage is 15.1%. The thermal resistance of the cooling device reduces about 0.43 ℃/W when the thickness of the shell increases from 0.8 mm to 2.4 mm, and the reducing percentage is 11.6%. The above change rates are all rapid at first and slow latter. As to the electronic module nowadays, the cooling will be improved a lot if the module is optimized according to the above result.

关 键 词：冷却 固态组件 热阻 导热系数 

分 类 号：TK124[动力工程及工程热物理—工程热物理]