(SiC_P+Gr_P)/Cu复合材料的制备与性能研究  

Preparation and Properties of(SiC_p+Gr_p)/Cu Composite

作　　者：陈旭杰[1] 

机构地区：[1]陕西理工学院材料科学与工程学院,陕西汉中723003

出　　处：《热加工工艺》2014年第8期117-119,共3页Hot Working Technology

基　　金：国家自然学基金资助项目(5043202);国家973基金资助项目(2007CB607603)

摘　　要：采用粉末冶金工艺制备了(SiCp+Grp)/Cu复合材料,用光学金相显微镜、扫描电镜、热膨胀分析仪和导热率测试仪研究了该复合材料的显微组织、热膨胀性能和导热性能。结果表明,增强颗粒在基体中分布较均匀,组织较致密。由于SiC颗粒和石墨的共同作用而使(SiCp+Grp)/Cu复合材料的热膨胀性能和导热性能介于相同体积分数石墨或SiC单一增强Cu基复合材料之间。（SiCp＋GrD）/Cu composite was prepared by powder metallurgy. The microstructure, thermal expansion and thermal conductivity of the sample were investigated by using OM, SEM, TEM and thermal expansion analyzer. The results show that the reinforced particle distributes uniformly and the microstructure is denser in （SiCp＋Grp）/Cu composite. The thermal expansion properties and thermal conductivity properties of the composite are between same volume fraction of SiCp/Cu and Grp/Cu composite due to the role.

关 键 词：(SiCp+Gro) CU复合材料 显微组织 热膨胀性能 导热性能 

分 类 号：TB333[一般工业技术—材料科学与工程]