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机构地区:[1]中北大学仪器科学与动态测试教育部重点实验室,太原030051 [2]中北大学电子测试技术国家重点实验室,太原030051
出 处:《固体电子学研究与进展》2014年第2期170-173,共4页Research & Progress of SSE
基 金:国家自然科学基金资助项目(61106077)
摘 要:提出一种嵌入式非平衡超结器件结构,在n型外延层上通过高能注入间隔的p型埋层,形成嵌入式的超结结构。n型电荷与p区在四周形成电荷耗尽,相对于常规的超结更利于提高漂移区浓度,改善导通电阻;同时,器件的表面是完整的n型区,缓解了场氧工艺中吸硼排磷效应对超结的影响,有利于控制超结的电荷平衡。三维器件仿真结果表明,在漂移区长度为10μm时,新结构下的器件耐压达到220V,而导通电阻为常规超结LDMOST的76%。A device structure with embedded unbalanced super junction (SJ) is proposed in this paper. The spaced p-type buried layers are implemented in n-type epitaxial layer by high-en- ergy implantation process to form the embedded SJ structure. N-type charges are depleted with p region from four directions, which increases the concentration of drift region compared with con- ventional SJ structure and reduces the on-resistance. Moreover, the complete n-type surface re- lieves the influence of field oxide process on SJ, which conduces to control the charge balance of SJ. Three-dimensional device simulation results indicate that the breakdown voltage of proposed device achieves 220 V at drift length of 10μm, and the on-resistance is reduced to 76 % compared with that of conventional SJ-LDMOST.
分 类 号:TN386[电子电信—物理电子学]
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