微波模块的三防设计  

The Three-proofing Design of Microwave Modules

作　　者：赵树伟[1] 

机构地区：[1]中国电子科技集团公司第四十一研究所,山东青岛266555

出　　处：《科技视界》2014年第6期75-76,共2页Science & Technology Vision

摘　　要：微波模块的三防性能是重要技术指标之一。本文简要分析了微波模块在三防方面存在的问题,详细阐述了从选材、结构设计、表面处理到微组装整个流程所采取的具体措施,针对不同的环境因素提出了一系列切实可行的封装工艺。通过这些技术,可在一定程度上提高微波模块的三防性能。The three-proofing property is one of the most important performances of microwave modules. This paper analyzes briefly the three-proofing problems for microwave modules, and then material selection, structure design, electroplate and assemble are discussed in detail, based on which a series of feasible seal process applicable to different environments are proposed. With these treatments the three-proofing property of microwave modules has been improved.

关 键 词：微波模块 结构设计 三防设计 密封 

分 类 号：TN015[电子电信—物理电子学]