Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials  

作　　者：E.Yang Hongyan Guo Jingdong Guo Jianku Shang Mingguang Wang 

机构地区：[1]Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences [2]College of Sciences,Northeastern University [3]Department of Materials Science and Engineering,University of Illinois at Urbana-Champaign

出　　处：《Acta Metallurgica Sinica(English Letters)》2014年第2期290-294,共5页金属学报（英文版）

基　　金：supported by the National Basic Research Program of China (No.2010CB631006);the National Natural Science Foundation of China (No.51171191)

摘　　要：Thermal resistance of low-melting-temperature alloy （LMTA） thermal interface materials （TIMs） was measured by laser flash method before and after different stages of heating. The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process. It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs. Due to the fast growth rate of intermetallic compound （IMC） at the solid-liquid interface, a thick brittle IMC is layer formed at the interface, which makes cracks easy to initiate and expand. Otherwise, the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase, and so, the TIM layer will not melt at the operating temperature.Thermal resistance of low-melting-temperature alloy （LMTA） thermal interface materials （TIMs） was measured by laser flash method before and after different stages of heating. The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process. It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs. Due to the fast growth rate of intermetallic compound （IMC） at the solid-liquid interface, a thick brittle IMC is layer formed at the interface, which makes cracks easy to initiate and expand. Otherwise, the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase, and so, the TIM layer will not melt at the operating temperature.

关 键 词：Thermal interface materials Low melting point alloy Thermal resistance 

分 类 号：TG132.33[一般工业技术—材料科学与工程]