TMA4000在电子工业领域中使用标准测试方法的应用  

Use of the TMA 4000 to Perform Standard Test Methods in the Electronics Industry

作　　者：Bruce Cassel Kevin Menard 

机构地区：[1]PerkinElmer Inc, 710 Bridgeport Ave, Shelton, USA

出　　处：《中国材料科技与设备》2014年第2期72-73,84,共3页Chinese Materials Science Technology & Equipment

摘　　要：电子线路板的主要破坏原因之一是由热膨胀引起的问题。要防止这种情况发生，电子工程师采用热导体来发散热量，用低膨胀性材料来配合低膨胀率的硅片和陶瓷绝缘体的使用。热机械分析（TMA）长期以来应用于测量线路板、电子元件和组成材料（CTE）。针对玻璃化转变温度、热膨胀系数变化的点、样品软化和应力释放效应的发生，已经建立起成熟可靠的标准测试方法。对于层状复合产品，TMA相应的测试方法可以确定在评估升温过程中材料的分层所需时阃。TMA4000的设计大大简化了上述测试过程，非常适用于测量低膨胀率的小器件的膨胀。本应用文章提供了这些标准方法的一些案例。A major source of failure in electronic circuits is thermal expansion, and the problems it causes. To prevent this, electrical engineers employ thermal conductors to dissipate the heat, and use lowexpansitivity materials to match the low expansion rate of silicon chips and ceramic insulators. Thermomechanical analysis （TMA） has long been used to measure thermal expansion （CTE） of circuit boards, electronic components, and component materials. There are well established standard test methods to make this measurement and to determine the glass transition temperature, the point at which the coefficient of expansion changes, the sample softens, and stress relief effects occur. Another TMA test method for laminated products determines the time to delamination at an elevated temperature. The TMA 4000 was specifically designed to facilitate these tests, and it is ideally suited for measuring the expansion of small components with low expansion rates. This application note gives examples of these standard methods.

关 键 词：TMA 4000 热膨胀系数 电子电路板 

分 类 号：TG115.25[金属学及工艺—物理冶金]