耐溶剂高温快速固化EP胶膜的研制  

Study on preparing high temperature fast curable EP adhesive film with solvent resistance

作　　者：邵康宸[1] 李会录[1] 韩江凌[1] 魏弘利[1] 刘文[2] 

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710054 [2]湖南警察学院,湖南长沙410138

出　　处：《中国胶粘剂》2014年第4期38-41,共4页China Adhesives

基　　金：国家自然科学基金资助项目(21204072)

摘　　要：以双酚A型环氧树脂(EP128、EP301)为基体树脂、聚氨酯热熔胶(PU-HMA)为增韧剂、双氰胺(DICY)为固化剂、2-乙基-4-甲基咪唑(2E4MZ)为固化促进剂和硅微粉为填料,制备耐溶剂高温快速固化EP胶膜。研究结果表明:采用单因素试验法优选出制备耐溶剂高温快速固化EP胶膜的最佳工艺条件是w(PU-HMA)=20%、w(DICY)=12%、w(2E4MZ)=0.8%、w(硅微粉)=20%(均相对于EP质量而言)、m(EP 128)∶m(EP 301)=1∶1、固化温度为210℃和固化时间为100 s,此时EP胶膜的耐溶剂性(90 s)相对最好、粘接强度(40.22 MPa)相对最大。With bisphenol A type epoxy resin （EP128, EP301） as matrix resins, polyurethane hot melt adhesive （ PU-HMA ） as flexibilizer, dicyandiamide （DICY） as curing agent, 2-ethyl-4-methyl imidazole （2E4MZ） as curing catalyst and silicon powder as filler, a high temperature fast curable EP （epoxy resin） adhesive film with solvent resistance was prepared. The research results showed that the optimal process conditions of preparing high temperature fast curable EP adhesive film with solvent resistance were preferred by single factor experiment method when mass fractions of PU-HMA, DICY, 2E4MZ and silicon powder were 20%, 12%, 0.8% and 20% respectively in EP, mass ratio of m（EP 128） ：m（EP 301） was 1： 1, curing temperature and curing time were 210℃ and 100 s respectively. Here, the EP adhesive film had the relatively best solvent resistance （90 s） and the relatively maximal bonding strength（40.22 MPa）.

关 键 词：环氧树脂 胶膜 耐溶剂性 快速固化 粘接强度 

分 类 号：TQ433.437[化学工程]