有机电致发光器件的新型薄膜封装技术研究  

A new thin-film encapsulation technology for organic light-emitting devices

作　　者：骆杨[1,2] 李天骄[3] 段羽[1] 

机构地区：[1]吉林大学电子科学与工程学院、集成光电子学国家重点联合实验室吉林大学实验区,吉林长春130012 [2]中国科学院长春光学精密机械与物理研究所,吉林长春130033 [3]吉林大学汽车工程学院,吉林长春130022

出　　处：《光电子．激光》2014年第5期840-844,共5页Journal of Optoelectronics·Laser

基　　金：国家高科技研究发展计划(2011AA03A110);国家重点基础研究发展计划(2010CB327701);国家自然科学基金(61275024,61274002,60706018,60906021,60977024,60876032,60907013);吉林省科技发展计划(201101034);教育部高等学校博士学科点专项科研基金(20070183088)资助项目

摘　　要：针对有机电致发光器件(OLED)在空气中水汽和O2作用下寿命下降的问题,提出一种对OLED进行薄膜封装方法。封装薄膜由电子束蒸镀Al2O3薄膜和原子层沉积(ALD,atomic layer deposition)Al2O3薄膜相结合形成。利用Ca薄膜电学测试方法测定封装薄膜的水汽透过率(WVTR)。具体实现方法是,采用玻璃作为衬底,在100nm的Al电极上蒸镀200nm的Ca膜,然后对整个系统进行薄膜封装,只留出Al电极的一部分作为探针接触电极。实验发现,采用电子束蒸镀结合ALD的Al2O3薄膜封装,Ca薄膜变成透明的时间比未封装或采用单一结构封装得到了延长。为了检验薄膜封装效果,制作了一组绿光OLED,器件结构为ITO/MoOX(5nm)/mMTDATA(20nm)/NPB(30nm)/Alq3(50nm)/LiF(1nm)/Al,实验结果表明,本文提出的薄膜封装方法对器件进行封装,器件的寿命得到了延长。Encapsulation is important for organic light-emitt!ng devices （OLEDs） to prevent oxidation of light-emitting materials and electrodes by blocking water vapor and oxygen, and to protect devices from external shocks. A new thin-film encapsulation method is proposed in this work. The film is formed by e- lectron beam evaporation （A12 03 film） combined with atomic layer deposition （A12 03 film）. We measure the water vapor transmission rate （WVTR） of the film with the method of Ca test. We use the glass substrate,deposit 200 nm film of Ca and 100 nm A1 electrode,and encapsulate the entire system with thin-film,leaving only part of the A1 electrode as the contact electrode. It is obvious that the oxide-time of Ca of the device encapsulated with electron beam evaporation layer combined with atomic layer is much longer than that of single encapsulation film structures. For further research,we fabricate a set of green OLED devices：ITO/MoOx（5 nm）/m-MTDATA （20 nm）/NPB （30 nm）/Alq （50 nm）/LiF（1 nm）/A1. The devices are encapsulated by the thin film which is mentioned above. The results show that the lifetime of device with thin-film encapsulation is extended than the device without thin-film encapsu- lation.

关 键 词：薄膜封装 水汽透过率(WVTR) 原子层沉积(ALD) 

分 类 号：TN383.1[电子电信—物理电子学]