湿度对微型加速度计粘连失效的影响  

The Adhesion Failure in the MEMS Accelerator Influenced by Relative Humudity

作　　者：宋运康[1] 赵坤帅[1] 闫鑫[1] 李川[1] 

机构地区：[1]西安飞行自动控制研究所,西安710065

出　　处：《传感技术学报》2014年第3期316-319,共4页Chinese Journal of Sensors and Actuators

基　　金：863预研课题项目(2011AA110102);国家国际科技合作项目专项项目(2011DFA72370)

摘　　要：粘连是微/纳器件的一种典型失效模式,由于湿度引起的粘连失效占很大比例。以MEMS摆式加速度计为模型,分析了湿度引起粘连失效的机理,主要是毛细黏性力的影响。为了研究材料性质和粗糙度对粘连的影响,对比钨(W)、铝铜(AlCu)和铝(Al)3种不同电极材料,发现Al电极材料表面接触角和表面粗糙度都很大,对应芯片的粘连比例较少。利用HMDS对粘连芯片内表面进行疏水处理,有效减少了粘连比例。研究表明选用接触角大的电极材料、增加电极表面粗糙度和表面疏水处理均能有效减少毛细黏性力为主导的粘连。Adhesion is a well-known failure mode in micro-electromechanical systems（ MEMS） ,most of them are in-fluenced by relative humidity. The capacitive MEMS micro-accelerator is studied,the theory of adhesion influenced by relative humidity is analyzed, especially the capillary force. In order to investigate the adhesion influenced by different material and surface condition,the material W,AlCu and Al are used. Al is approved to be a good material with high contact angle and roughness, and the adhesion occurred on the Al electrode surface is the least. The HMDS is also used to deal with the inner surface of the MEMS chip,which is a good way to decrease adhesion. It is proved that choosing electrode material with high contact angel and large roughness,processing the contact surface with hydrophobic layers are good method to decrease adhesion dominated by relative humidity.

关 键 词：粘连 毛细黏性力 粗糙度 HMDS(六甲基二硅胺烷) 

分 类 号：V241.6[航空宇航科学与技术—飞行器设计] TH706[机械工程—仪器科学与技术]