反光膜微结构阵列电铸电流密度分析  

An Analysis of Current Density Distribution in Microstructure Array Electroforming of Reflective Membrane

作　　者：杨光[1] 皮钧[1] 

机构地区：[1]集美大学机械与能源工程学院,福建厦门361021

出　　处：《电镀与环保》2014年第3期22-25,共4页Electroplating & Pollution Control

基　　金：国家自然科学基金资助项目(No.51175225);福建省工业科技重点项目(No.2013H0031)

摘　　要：为了获得高质量的微结构阵列反光膜产品,控制电铸过程尤为重要。芯模所在阴极表面的电流密度分布直接影响电沉积层的质量。对不同形状的芯模和不同极板间距的微棱结构电铸系统,利用有限元方法分析了阴极表面的电流密度。结果表明:极板间距直接影响电流密度分布,计算值与测试结果吻合;芯模棱锥顶角发生变化,该位置处的电流密度变化不大;芯模棱锥深宽比对电流密度分布影响很大;当棱锥侧面与基板夹角为锐角时,凹槽处很难电铸。实际微棱电铸结果说明了仿真的可靠性。In order to get high quality microstructure array reflective membrane products,control of electroforming process is particularly important.The current density distribution in cathode surface where the core module resides directly affects the quality of electrodeposits.For micro prism structure electroforming systems with different core mould shapes and different electrode plate distances,the current density in the cathode surface was analyzed by using finite element method.The results show that the distance between electrode plates directly affects the current density distribution,the calculated values are accord with the experimental results; when the apical angle changes,the current density in this position only has a slight change; the depth to width ratio of core mould pyramid has a great influence on the current density distribution; when the angle between the pyramid side and the substrate is an acute angle,electroforming is difficult in grooves.The results of actual micro prism electroforming illustrate the reliability of simulation.

关 键 词：微结构阵列 棱锥角度 极板间距 电流密度分布 

分 类 号：TQ153.4[化学工程—电化学工业]