二氧化硅微球化学镀银  

Studies on the Silver Electroless Plating on Silica Spheres

作　　者：黄茜[1] 黄惠[1] 郭忠诚[1,2] 

机构地区：[1]昆明理工大学冶金与能源工程学院,云南昆明650093 [2]昆明理工恒达科技有限公司,云南昆明650106

出　　处：《电镀与精饰》2014年第5期1-4,共4页Plating & Finishing

基　　金：国家自然科学基金资助(50974065和51004057);云南省自然科学基金(2011FZ031和2013FA012);昆明理工大学分析测试基金(2010198)

摘　　要：采用AgNO3为活化剂对二氧化硅微球进行化学镀银。通过单因素实验研究了敏化剂、活化剂、还原剂种类及主盐质量浓度对化学镀银复合粉体电阻率、银利用率的影响。研究结果表明,敏化剂和活化剂的浓度增加有利于复合粉体电阻率的降低,在不同还原剂中葡萄糖效果最好,主盐质量浓度的增加有利于减小电阻率,但同时银的利用率会降低。Silver electroless plating was conducted on silica spheres using AgNO3 as activator. Effects of the activator type, reducer type, sensibilizer type as well as the main salt mass concentration on the resistivity of composite powder and the silver availability were investigated by means of single factor experiment. The results revealed that increase of the activator and sensibilizer concentration were of benefit to the decrease of the resistivity of composite powder. Glucose was the best reducer. Enhance of the main salt mass concentration could decrease the resistivity, but the silver availability would also decrease.

关 键 词：二氧化硅 化学镀银 影响因素 

分 类 号：TQ153.16[化学工程—电化学工业]