共晶Sn3.8Ag0.7Cu焊料在Fe-Ni镀层上的反应润湿行为  

Reactive wetting of eutectic Sn3.8Ag0.7Cu solder on electrodeposited Fe-Ni alloy layer

作　　者：刘葳[1] 金鹏[1] 

机构地区：[1]北京大学深圳研究生院环境与能源学院,广东深圳518055

出　　处：《电子元件与材料》2014年第6期31-33,共3页Electronic Components And Materials

基　　金：国家自然科学基金青年基金资助项目(No.51301003);深圳市产业发展专项资金资助项目(No.JC201105170718A)

摘　　要：用电镀工艺制备了Fe-Ni镀层,研究了还原气氛保护下共晶Sn3.8Ag0.7Cu焊料在Fe-Ni镀层上的反应润湿行为。结果表明:在共晶Sn3.8Ag0.7Cu与Fe-74Ni反应润湿体系观察到了伪部分润湿行为。在铺展球冠的前沿,可以明显地看到有液态膜伸出主液体铺展前沿。随着回流时间的增加,液态膜逐渐长大。共晶Sn3.8Ag0.7Cu焊料与Fe-74Ni电镀合金层的液固界面生成了一层FeSn2化合物,还有大量Cu/Ni/Sn化合物进入焊料内部。Reactive wetting of eutectic Sn3.8Ag0.7Cu solder on electrodeposited Fe-Ni alloy layer was investigated in a vacuum furnace with H2＋Ar protection. In this reactive wetting system, a pseudo-partial wetting phenomenon is found, that is a liquid film attaches to the main liquid front and grows with the increase ofreflow time. A player of FeSn2 grows on interface between eutectic Sn3.8Ag0.7Cu solder and Fe-74Ni alloy, and many Cu/Ni/Sn compounds go into solder.

关 键 词：共晶Sn3 8Ag0 7Cu焊料 Fe-Ni镀层 反应润湿 液态膜 互联界面 微观组织结构 

分 类 号：TG454[金属学及工艺—焊接]