快速冷热循环对铝薄膜结构的影响  

Effect of Rapid Cool-thermal Cycle Testing on Al Thin Films

作　　者：夏志鹏[1] 鹿业波[1] 胡慧[1] 金清[1] 王慧[1] 唐睿强 

机构地区：[1]嘉兴学院机电工程学院,浙江嘉兴314001

出　　处：《嘉兴学院学报》2014年第3期106-109,共4页Journal of Jiaxing University

基　　金：国家级大学生创新创业训练计划项目(201310354009);浙江省钱江人才资助项目(QJD1302007)

摘　　要：针对铝薄膜进行了快速冷热循环试验,模拟焦耳热变化并研究影响机理.试验结果表明,对比于恒温加热,焦耳热循环变化会导致应力迁移速率持续变化,对铝薄膜表面形成变应力冲击,同时加剧表面疲劳微裂纹的形成与扩展,最终使表面小丘数量和体积显著增加,致使集成电路失效概率大幅提高.The AI thin film was used for rapid coot-thermal cycle testing in order to investigate the effect of the Joule heating. It was found that rapid cool-thermal cycle testing would result in variable velocity of stress migration and unstable compressive stress. Cracks were formed on the surface of the AI film owing to fatigue damage,and the number and volume of the hillocks were significantly larger than the sample under constant heating testing.

关 键 词：铝薄膜 冷热循环 应力迁移 小丘 

分 类 号：TB383[一般工业技术—材料科学与工程]