Temperature-Dependence of Microstructure Evolution in a Ferroelectric Single Crystal with Conducting Crack  

作　　者：黄成 高存法 王杰 

机构地区：[1]State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, P.R. China [2]School of Aeronautics and Astronautics, Zhejiang University, Hangzhou, 310058, P.R. China

出　　处：《Transactions of Nanjing University of Aeronautics and Astronautics》2014年第2期200-208,共9页南京航空航天大学学报（英文版）

基　　金：support from the National Natural Science Foundation of China(11232007)

摘　　要：The different temperature-induced nonlinear behavior near a conducting crack tip in a ferroelectric single crystal is studied based on a phase field approach containing the time-dependent Ginzburg-Landau equation.Since domain switching in a crack tip plays an important role in the fracture behavior,by using three-dimensional nonlinear finite element method,the temperature-induced domain switching behavior of a ferroelectric single crystal is simulated under applied electrical and mechanical loads.The simulations show that increasing the temperature will enhance the crack propagation under a strong electric field,which results in switching-weakening.In particular,increasing the temperature from 300°C to 600°C will impede the crack propagation under combined mechanical and electric field loading,which results in switching-toughening.Salient features of the results are consistent with many experimental observations.The different temperature-induced nonlinear behavior near a conducting crack tip in a ferroelectric single crystal is studied based on a phase field approach containing the time-dependent Ginzburg-Landau equation. Since domain switching in a crack tip plays an important role in the fracture behavior, by using three-dimensional nonlin- ear finite element method, the temperature-induced domain switching behavior of a ferroelectric single crystal is simulated under applied electrical and mechanical loads. The simulations show that increasing the temperature will enhance the crack propagation under a strong electric field, which results in switching-weakening. In particular, increasing the temperature from 300 ℃ to 600 ℃ will impede the crack propagation under combined mechanical and electric field loading, which results in switching-toughening. Salient features of the results are consistent with many experimental observations.

关 键 词：phase field simulation domain switching conducting crack finite element analysis 

分 类 号：O321[理学—一般力学与力学基础]