二甲基甲酰胺中钬镍合金的电沉积  

Electrodeposition of Ho-Ni Alloy from Dimethyformamide Bath

作　　者：王宇[1] 刘冠昆[1] 何凤荣[1] 童叶翔[1] 

机构地区：[1]中山大学化学与化学工程学院,广州510275

出　　处：《物理化学学报》2001年第3期206-209,共4页Acta Physico-Chimica Sinica

基　　金：广东省自然科学基金资助项目!(960002)&&

摘　　要：研究了在二甲基甲酰胺 (DMF)体系中钬的电还原及钬与镍的电解共沉积 .结果表明，由于微量水在电极上还原形成不溶的导电性差的膜层，使钬单独沉积很困难 .恒电位电解用于制备钬镍合金， EDAX,SEM和 XRD用于分析镀层，得到了黑色粘附性好的非晶态钬镍合金镀层，钬的含量可高达 72.7％ .Cyclic voltammetry was used to study the electroreduction of Ho(III) in Ho(NO3)(3)-LiClO4-DMF. The results showed that traces of water in this system blocked the electroreduction of Ho(III) by forming LiOH and Ho(OH)(3) films on the electrode surface. Co-deposition of Ho and Ni was studied in dimethylformamide by cyclic voltammetry and potentiostatic deposition at room temperature. Potentiostatic deposition was used to prepare Ho-Ni alloys. EDAX, SEM and XRD were used to analyze the films. The results indicated that black, adhesive and amorphous Ho-Ni alloy films on Cu were produced where the content of Ho could be as high as 72.7%.

关 键 词：恒电位电解 二甲基甲酰胺 钬镍合金 电解共沉积 合金镀层 

分 类 号：TQ153[化学工程—电化学工业]