外源SA和DPI对灌浆期高温强光下小麦叶片气孔开闭的影响  

Effects of Exogenous SA and DPI on the Stomatal Closure of Wheat Leaves under Heat and High Light Stress during Grain Filling Stage

作　　者：张欢玲[1] 刘淑春[1] 苏小雨[1] 赵会杰[1] 李春奇[1] 汪月霞[1] 

机构地区：[1]河南农业大学生命科学学院,河南郑州450002

出　　处：《作物杂志》2014年第3期67-71,共5页Crops

基　　金：国家自然科学基金项目(31000688);河南省教育厅科学技术研究重点项目(13A210487)

摘　　要：为了探讨外源物质对灌浆期小麦抗逆性的调节机理,以小麦品种矮抗58为对象,研究了高温强光胁迫下,不同浓度的外源水杨酸(SA)和二苯基氯化碘盐(DPI)预处理对叶片气孔开闭及其抗氧化酶活性等生理影响。结果表明,灌浆期高温强光下,DPI处理叶片气孔开度与其浓度渐呈负相关,DPI可部分削弱SA诱导的胁迫抗性,浓度为10mmol/L DPI能够加剧胁迫下植物的伤害程度。DPI与0.3mmol/L SA处理灌浆期小麦,可显著促进高温强光胁迫下的小麦抗氧化物酶活性,清除多余的活性氧,从而提高小麦叶片的高温强光胁迫抗性。本研究结果可以为高温强光胁迫下小麦的抗逆生产提供一定的理论依据。In order to investigate the regulation mechanism of exogenous substances on wheat plants suffering heat and high light stress during grain filling stage,wheat variety Aikang 58 was used as material, to study the effect of exogenous salicylic acid （SA） and diphenyleneiodonium chloride （DPI） on the stomatal closure and the activities of antioxidant enzymes. The results showed that, under heat and high irradiance stress, a negative correlation between wheat stomatal closure and DPI concentration ,while DPI could weaken the SA-induced stress resistance. Furthermore, 10mmol/L DPI could exacerbate the degree of damage on wheat plants under the stress. When wheat plants were supplemented by DPI and 0.3 mmol/L SA at grain filling, the activities of antioxidant enzymes were significantly improved to remove excess reactive oxygen species ,which enhanced the stress resistance to heat and high light stress. The present results could offer a theoretical basis for the stress-resistant production of wheat plants suffered heat and high light stress.

关 键 词：小麦 水杨酸 高温强光胁迫 二苯基 氯化碘盐 抗氧化酶 

分 类 号：S512.1[农业科学—作物学]