激光软钎焊技术在SMT领域内的现状与展望  

Research Status and Prospect of Laser Soldering Technology in the Field of SMT

作　　者：韩彬[1,2] 檀正东 周旋 陈勇 王海英 李明雨[2] 史建卫 

机构地区：[1]深圳市艾尔摩迪精密科技有限公司,广东深圳518103 [2]哈尔滨工业大学深圳研究生院,广东深圳518055 [3]集适自动化科技(上海)有限公司深圳分公司,广东深圳518103

出　　处：《电子工业专用设备》2014年第1期1-7,12,共8页Equipment for Electronic Products Manufacturing

摘　　要：激光软钎焊技术由于具有局部加热,快速加热,快速冷却等特点,更适合于微、小型电子元器件的"无铅化"组装,具有广阔的应用前景。通过查阅大量文献,综述了应用于软钎焊中各类激光器的特点,国内外激光软钎焊技术的研究现状等方面的内容,并对其在SMT领域内的发展前景与方向做了简要的分析。Due to the characteristics of local heating, fast heating and fast cooling, laser soldering technology is more suitable for micro and small electronic com ponents "lead free" assem bly and has wide application foreground.Through consulting a number of literature materials,this paper overviews the characteristics of the various types of laser applied on soldering, domestic and foreign research status of laser soldering technology. It also makes a brief analysis on the developm ent prospects and direction of laser soldering on SMT .

关 键 词：表面组装技术 激光 软钎焊技术 发展前景与方向 

分 类 号：TG425+.1[金属学及工艺—焊接]