芳纶纤维表面化学镀Ni-Cu-P的研究  

Study on electroless Ni-Cu-P plating on surface of Kevlar fibers

作　　者：蒋先万 方东升[2] 杨雅琪[1] 马旭霞[1] 沈雪青 段永华[1,2] 

机构地区：[1]昆明理工大学材料科学与工程学院,昆明650093 [2]昆明理工大学稀贵及有色金属先进材料教育部重点实验室,昆明650093

出　　处：《化工新型材料》2014年第6期96-98,共3页New Chemical Materials

基　　金：国家自然科学基金资助项目(50871049)

摘　　要：采用化学镀技术,实现了芳纶纤维表面Ni-Cu-P的合金化处理,利用SEM、EDS和XRD分别对芳纶纤维原始样品、粗化后及施镀后的表面形貌、原始纤维及镀层的成分和物相组成进行了分析比较,并用冷热循环法对合金化后的芳纶纤维进行了结合力测试。结果表明:芳纶纤维表面化学镀Ni-Cu-P后呈灰色,镀层与基体结合力较好,镀层中Ni的质量含量为5.44%,Cu的为18.57%,P的为6.39%,且镀层以Cu、Ni3P、Cu3P为主。Electroless coating of Ni-Cu-P on Kevlar fibers was investigated by means of SEM, EDS and XRD. The adhesion strength of coating was tested by method of cold and heat cycle. The results showed that the color of Ni-Cu-P-coa- ted fibers was gray and the coating had good adhesion with the fiber. Furthermore, the Ni content in the coating was 5. 44 %, the Cu was 18.57 % and the P was 6.39 %, the phase of coating was mostly consisted of Cu,Cu3 P and Ni3 P.

关 键 词：芳纶纤维 表面改性 化学镀NI-CU-P 结合力 

分 类 号：TS102.5[轻工技术与工程—纺织工程]