配位剂对GH202合金化学镀镍–磷的影响  

Effects of complexants on electroless nickel– phosphorous plating on GH202 alloy

作　　者：曾凡[1,2] 谭澄宇[1,2] 龙亚雄 马灿[1,2] 

机构地区：[1]中南大学有色金属材料科学与工程教育部重点实验室,湖南长沙410083 [2]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《电镀与涂饰》2014年第11期470-473,共4页Electroplating & Finishing

基　　金：军工配套项目(MKPT-04-106)

摘　　要：研究了配位剂CH3COONa和NH4C1对GH202合金酸性化学镀镍镀速和镀层磷含量的影响，分析了化学镀过程中镍离子和次磷酸根离子的消耗量。镀液的组成和工艺条件为：NiSO4·7H2O 80 g／L，NaH2PO2·H2O 24g/L，H3BO3 8 g／L，CH3COONa·H2O 6～15 g，L，NH4Cl 3～6 g/L，pH 5．0，温度85℃，时间2 h。随镀液中CH3COONa含量增加，沉积速率先增大后减小，镀层磷含量则在6．19％-10．45％范围内呈小幅波动。随镀液中NH4Cl含量增大，沉积速率变化不大，但镀层磷含量减小。随化学镀时间延长，镀液中镍离子和次磷酸根离子的消耗速率均减小。镀液中CH4COONa与NH4C1的较优质量浓度分别为12 g／L和6 g/L。采用该体系化学镀所得Ni-P镀层表面平整，厚度约为50℃m，磷的质量分数为6．19％，结合力良好，综合性能基本满足GH202合金表面预镀镍层的要求。The effects of complexants CH3COONa and NH4Cl on deposition rate and phosphorous content of electroless nickel coating on GH2O2 alloy were studied. The consumptions of nickel and hypophosphite ions during the electroless plating process were analyzed. The plating bath composition and process condition are as follows： NiSO4·7H2O 80 g/L, NaH2PO2·H2O 24 g/L, H3BO3 8 g/L, CH3COONa·H2O 6-15 g/L, NH4Cl 3-6 g/L, pH 5.0, temperature 85 ℃, and time 2 h. With increasing CH3COONa content in bath, the deposition rate is increased firstly and then decreased, while the P content in coating varies slightly in the rage of 6.19%-10.45%. With increasing NH4Cl content in bath, the deposition rate changes little, but the P content in coating is decreased. Both the consumption rates of nickel and hypophosphite ions are decreased with the extending of electroless plating time. The optimal mass concentration is 12 g/L for CH3COONa and 6 g/L for NH4Cl in the bath. The Ni-P coating prepared from the given plating bath has a smooth surface with a thickness of 50 μm, mass fraction of P 6.19%, and excellent adhesion, and shows a comprehensive performance basically meeting the demand ofpre-plated nickel coating on the surface of GH202 alloy.

关 键 词：镍—磷镀层 化学镀 配位剂 沉积速率 结合力 

分 类 号：TQ153.2[化学工程—电化学工业]