基于内聚区模型的InSb面阵探测器分层研究  

Delamination study of InSb infrared focal plane arrays using a cohesive zone model

作　　者：孟庆端[1] 贵磊[1] 张晓玲[2] 张立文[1] 耿东峰[3] 吕衍秋[3] 

机构地区：[1]河南科技大学电气工程学院,洛阳471023 [2]河南科技大学信息工程学院,洛阳471023 [3]中国空空导弹研究院,洛阳471009

出　　处：《物理学报》2014年第11期386-391,共6页Acta Physica Sinica

基　　金：国家自然科学基金青年科学基金(批准号:61107083;61205090)资助的课题~~

摘　　要：液氮冲击中InSb面阵探测器表面经常出现局部分层、开裂等失效模式.为明晰材料分层、光敏元芯片断裂过程,基于三维等效建模设想,在易分层处添加内聚区模型,合理选取界面分层开裂参数,建立了128×128InSb探测器结构分层模型.模拟结果涵盖了典型碎裂照片中呈现的所有形变信息,即1)在光敏元阵列区域,复现出典型棋盘格屈曲模式;2)在Negative电极区域上方,InSb芯片与下层材料逐渐分开,且分层向两侧逐步扩展;3)在面阵探测器周边区域,表面起伏相对平整.上述模拟结果证明了所建分层模型的正确性和参数选取的合理性,为后续裂纹起源、传播过程的研究提供了模型基础.Local interfacial delamination and cracking, appearing in the top surface of InSb infrared focal plane arrays （IRF- PAs）, are typical failure patterns observed in liquid nitrogen shock tests. In order to explore the delamination mechanism and cracking process, based on the thought of three-dimensional equivalent modeling, we employ the cohesive zone model （CZM） for the interface where delamination appears most easily, and create the structural model of 128~ 128 InSb IRF- PAs. Simulation results contain all the deformation characteristics appearing in the typical optical fracture photographs. That is, firstly, in the photosensitive element array, the global square checkerboard buckling pattern reappears; secondly, in the negative electrode material, the InSb chip is gradually separated from the negative electrode, and the width of delamination is widened gradually; thirdly, on the periphery of InSb IRFPAs, the surface is flat. All these findings sug- gest that the model created in this paper is correct, and the parameters selected are suitable. Based on the delamination model, it is possible to find the initiation and propagation rule of cracks in the research that follows.

关 键 词：面阵探测器 内聚区模型 结构分层 

分 类 号：TN215[电子电信—物理电子学]