叠层片式PTC热敏陶瓷与基体研究进展  

Research progress of multilayer chip-type PTC ceramics and matrix

作　　者：程绪信[1] 赵肇雄[1] 周东祥[2] 傅邱云[2] 崔海宁[1] 

机构地区：[1]肇庆学院电子信息与机电工程学院,广东肇庆526061 [2]华中科技大学光学与电子信息学院教育部敏感陶瓷工程研究中心,湖北武汉430074

出　　处：《电子元件与材料》2014年第7期4-7,28,共5页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.61179055);广东省教育厅自然科学育苗工程项目资助(No.2013LYM0099);肇庆学院青年基金资助项目(No.201320);肇庆学院博士启动基金资助项目

摘　　要：叠层片式PTC热敏陶瓷(MLPTC)具有尺寸小、质量轻、电阻低、通流量大、反应快、无明火、无触点、无噪音和可修复等优点,可作为低压电路中过流保护和温度补偿等元件。介绍了叠层片式PTC热敏陶瓷的发展历程和研究现状,以及该样品基体配方的研究,分析了当前制备工艺中存在的问题,并提出了解决的方法,同时指出叠层片式PTC热敏陶瓷向着低阻化、片式化、微型化和绿色化方向发展。The multilayer chip-type PTC ceramics possess small size, light weight, well stability and good enduring large current rushing, which are used to the component of the over current protection in low-voltage circuit and the compensation on the temperature. The development history, the research status and the matrix formulation of the multilayer chip-type PTC ceramics are introduced. The existent problems on the current preparation technology are analyzed, and the solutions are given as well. Meanwhile, the developmental trends of the green, micromation, chip type and resistance lowering for the multilayer chip-type PTC ceramics are put forward.

关 键 词：BATIO3陶瓷 PTC效应 综述 热敏陶瓷 叠层片式 低阻化 

分 类 号：TN37[电子电信—物理电子学]