改进的圆柱面接触热阻模型及其应用  

An improved model for thermal joint resistance of cylindrical contact and its application

作　　者：殷阁媛 厉彦忠[1] 郑江[1] 

机构地区：[1]西安交通大学能源与动力工程学院,西安710049

出　　处：《低温工程》2014年第3期16-21,共6页Cryogenics

基　　金：国家重大科技专项(***040304.1);国家自然科学基金(51376142)项目资助

摘　　要：在惯性约束核聚变冷冻靶系统中,硅冷却臂与封装套的装配面会产生显著的接触热阻。为了预测该热阻,提出了一种改进的适用于柱面接触且有胶粘剂填充装配间隙的接触热阻计算模型,该模型计算了通过材料接触部分和接触间隙的传热。用柱面裸接触的实验数据对模型进行了验证。分析结果表明采用较光滑的接触面和导热系数较大的胶粘剂可有效降低接触热阻,而装配应力及胶在固体上的接触角对接触热阻影响不大。The thermal contact resistance（ TCR） between silicon cooling arms and the thermo-mechanical package（ TMP） is significant in the inertial confined fusion cryogenic target systems. For predicting the resistance of the system,an improved model for thermal joint resistance of cylindrical contact surfaces filled with bonding materials was proposed,where the joint resistance network was obtained by analyzing the heat conduction in both the substrate and the gap. The model was verified by the experimental results of bare cylindrical contacts in the literature. On the basis of this model,it can be found that the TCR is significantly reduced by applying smoother surfaces and adhesives with high thermal conductivity,yet it is less affected by assembly stress and the contact angle of the adhesive on the substrate.

关 键 词：接触热阻 改进模型 封装套 胶 

分 类 号：TB66[一般工业技术—制冷工程]