Mg/Cu接触反应钎焊中共晶液相的产生及铺展行为的研究  

Spreading Behaviors and Orientation of Production of Eutectic Liquid of Mg/Cu by Contact Reactive Brazing

作　　者：杜双明[1] 党萍萍 刘刚[1] 

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710054

出　　处：《热加工工艺》2014年第11期45-47,51,共4页Hot Working Technology

摘　　要：研究Mg/Cu接触反应共晶液相产生的方向性以及共晶液相在Mg、Cu基体表面的铺展行为,揭示了加热温度和保温时间对共晶液相在铜基体表面铺展面积的影响规律。结果表明,Mg-Cu共晶液相优先在Cu/Mg扩散偶的镁一侧形成,其与基体存在润湿铺展和晶间渗透两种作用,其中共晶液在铜基体上以润湿铺展为主,而在镁基体上以晶间渗透为主。加热温度520℃、保温时间超过15 min时,Cu/Mg扩散偶共晶液相开始在铜基体表面铺展,随着保温时间的延长,铺展面积呈现先快速增加后慢速增加的变化规律。随着加热温度的升高,Cu/Mg扩散偶共晶液相在铜基体表面的铺展面积呈现先增加后减小的变化规律。The spreading behaviors of Mg/Cu in contact reactive brazing were studied, the impact of time and temperature on the Mg/Cu orientation of production of eutectic liquid in contact reactive brazing were investigated. The results show that eutectic liquid prefers to be formed on Mg in Cu/Mg diffusion couple. Mg-Cu eutectic liquid and matrix spreads and penetrates through grain, when Cu is taken as matrix, the spreading of Mg-Cu eutectic liquid on the surface of Cu is better. When taking Mg as the matrix, the diffusion of eutectic liquid in the Mg in the depth direction is more obvious. When the heating temperature is 520℃ and holding time is more than 15 min, the eutectic liquid of Cu/Mg diffusion couple begins to spread on the Cu surface, with increasing holding time, spreading area increases rapidly at first and then slowly increases. With the increase of heating temperature, the spreading area of eutectic liquid of Cu/Mg diffusion couple on copper surface area first increases and then decreases.

关 键 词：MgCu接触反应钎焊 接触反应偶 共晶反应 铺展 

分 类 号：TG454[金属学及工艺—焊接]