电沉积组分调制合金的技术进展及工艺设计  

The Evolution and Technology Design for Compositionally Modulated Alloys Electrodeposition

作　　者：刘凤岭[1] 刘佑厚[1] 

机构地区：[1]北京航空材料研究院,北京100095

出　　处：《电镀与精饰》2001年第1期14-17,共4页Plating & Finishing

摘　　要：组分调制合金的多层膜结构中由于存在薄膜效应、界面效应、耦合效应和周期性效应而使特性增强或产生出新颖的特性。利用电化学方法可制造结构可控的组分调制合金新材料 ,综述了电沉积组分调制合金的技术进展 ,并分析了电解液组分、p H值、温度、搅拌速度、脉冲电位和时间等电沉积工艺参数对多层膜组分、结构和调制波长的影响。Multilayered structure of compositionally modulated alloys (CMA), in which there are thin film effect, interface effect, coupling effect and periodicity effect present, may give rise to enhanced or novel layer property. Microtructure composition and layer thickness controllable CMA new materials can be prepared by using electrochemical deposition. In this paper, technology evolution for CMA electrodeposition are reviewed. The effect of electrodeposition parameters including the electrolyte composition, pH, temperature, agitation rate, and pulse parameter on composition, microtructure, layer thickness of CMA is analyzed.

关 键 词：组分调制合金 电沉积 多层模结构 新材料 

分 类 号：TQ153.2[化学工程—电化学工业]