模具钢大面积微结构的微细电解和化学蚀刻的比较研究  

The Comparative Study on Micro ECM and Chemical Etching of Large Area Micro Structure Die Steel

作　　者：黄红光[1] 郭钟宁[1] 孙涛涛[1] 宋卿[1] 

机构地区：[1]广东工业大学机电工程学院,广东广州510006

出　　处：《电加工与模具》2014年第A01期41-44,共4页Electromachining & Mould

基　　金：国家自然科学基金重点资助项目(U1134003);国家青年科学基金资助项目(51205066)

摘　　要：针对手机后盖表面微结构的特点,采用微细电解和微细蚀刻的方法,对手机后盖压制模具的表面微结构加工进行工艺探索。设计了掩膜图形,研制了微细电解加工的纳秒脉冲电源。利用自行研制的多功能微细特种加工系统,采用阳极掩膜的方法进行微细电解加工,采用改进后的蚀刻机进行模具钢微细蚀刻加工。通过优化工艺,在模具钢材料上加工出尺寸为500μm的阵列微结构,并注塑出手机后盖,达到项目要求。In the light of the surface micro-structure characteristic of phone rear,the processtechnology of surface micro-structure machining for phone rear mold in micro ECM and micro etchingwere studied. The mask was designed,the nanosecond pulse power of ECM is developed. The anodemask micro-ECM experiments was conducted in multi ＇functional micro non-traditional machiningsystem, also micro etching experiments of die steel was conducted in etching machine. By optimizingthe process,the array microstructure which size is 500 μm is machined in mold surface,and the phonerear was injected, and meted project requirements.

关 键 词：大面积微结构 微细电解 蚀刻 

分 类 号：TG662[金属学及工艺—金属切削加工及机床]