阵列式大功率LED灯热分析  

Thermal Analysis for Array High-Power Explosion Proof LED Light

作　　者：廖绍凯[1] 梅甫良[1] 林广平[1] 魏坛霖 

机构地区：[1]嘉兴学院建筑工程学院,浙江嘉兴314001 [2]创正防爆电器有限公司,浙江嘉兴314000

出　　处：《机电工程技术》2014年第6期4-7,44,共5页Mechanical & Electrical Engineering Technology

基　　金：嘉兴市科技特派员计划项目(编号:2012BY8010);嘉兴市科技计划项目(编号:2012BZ5003)

摘　　要：基于ANSYS仿真软件,设计了一款用于石油化工场所的阵列式大功率防爆LED灯。为满足特殊环境的散热要求,从灯具结构散热设计、材料的选择、芯片发热量以及环境参数的合理定义进行了较为细致的探讨和分析,模拟计算了灯具的温度场、温度梯度以及热流密度,得到了芯片和灯体表面的温度;然后按照数值分析模型参数,进行了样品制作,并对其进行整机温度试验;最后对仿真结果和温度试验数据进行了定量和定性分析,验证了所选用的数值模型和分析方法的正确性。Based on ANSYS simulation software, this paper designed an array high-power explosion proof LED light used in petrochemical sites. In order to meet with the radiating requirement for special environment, this paper had a detailed discussion and analysis from radiating design of the light structure, material choosing, chips heating value and reasonable definition of environmental specification,simulated the calculation of the light temperature field,temperature gradient and heat flux,got the chip and light surface temperatures,and made sample according to the numerical analysis model specification,tested the whole device temperature. At last,it had quantitative and qualitative analyzing on the simulation result and temperature test data, and proved that numerical model and analysis method are correct.

关 键 词：阵列式 大功率 LED 散热 仿真 温度试验 

分 类 号：TK123[动力工程及工程热物理—工程热物理]