双酚A二烯丙基醚/双马来酰亚胺树脂固化动力学研究  

Study on curing kinetics of bisphenol A diallyl ether/bismaleimide resin

作　　者：冯书耀 颜红侠[1] 贾园[1] 李婷婷[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2014年第6期1-4,共4页China Adhesives

基　　金：高等学校博士学科点专项科研基金资助课题(博导类)(20136102110049);西北工业大学博士论文创新基金资助项目(CX201429)

摘　　要：以BBE（双酚A二烯丙基醚）作为BDM（4，4＇-二氨基二苯甲烷双马来酰亚胺）树脂的改性剂，采用旋转黏度计和非等温DSC（差示扫描量热）法分别研究了BBE／BDM树脂体系在不同温度时的黏度和固化反应动力学过程。研究结果表明：该树脂体系在90—215℃范围内具有较低的黏度（低于1000mPa·s），完全满足RTM（树脂传递模塑）的工艺要求；该树脂体系的凝胶温度为210．7℃、固化温度为254．7℃和后处理温度为287．7℃，其固化体系的表观活化能为209．79kJ／mol、频率因子为3．23×1018s-1和反应级数为0．955（近似1级反应）。With BBE （bisphenol A diallyl ether） as modifier of BDM[4, 4＇-diamino diphenyl methane- BMI（bismaleimide）] resin, the viscosity and curing reaction kinetics process at different temperatures of BBE/BDM resin system were respectively investigated by rotational viscometer and non-isothermal DSC （differential scanning calorimetry） method. The research results showed that the resin system had lower viscosity （less than 1 000 mPa＇s） within the range of 90-215 ℃ , and could fully meet the technological requirements of RTM （resin transfer molding）. The gelation temperature, curing temperature and post-processing temperature of the resin system were 210.7,254.7,287.7 ℃ respectively, its apparent activation energy, frequency factor and reaction order of the curing system were 209.79 kJ/mol, 3.23×1018s-1 and 0.955 （approximate level 1-reaction） respectively.

关 键 词：双马来酰亚胺 双酚A二烯丙基醚 固化动力学 

分 类 号：TQ323.9[化学工程—合成树脂塑料工业]