3D片上光互连网络研究(本期优秀论文)  

Study of 3D on-chip optical interconnection network

作　　者：吴华炳 陈舜儿[1] 刘伟平[1,2] 

机构地区：[1]暨南大学电子工程系,广州510632 [2]中山新诺科技有限公司,广东中山528437

出　　处：《光通信技术》2014年第6期1-4,共4页Optical Communication Technology

基　　金：广东省教育部产学研重点项目(No.2012B091000155)资助;广东省战略新兴产业项目(No.2011912027)资助

摘　　要：介绍了片上光互连的优势及其几个重要器件,并分析其网络的基本单元、开关网络结构和3D互连结构,提出了现阶段最主要的技术问题及其未来研究方向集中在片内光源的研制和片外光源耦合、互连网络功耗和温度的控制、互连网络结构和路由算法的优化三方面。The advantages of the on-chip optical interconnect and its several important components are introduced.The basic unit of the on-chip optical interconnection network, structure of switching network and three-dimensional on-chip optical interconnection are analyzed. Moreover, the present stage the main technical problems and future research direction of optical interconnection network are proposed ,which are mainly concentrated in the design of the light source inside and coupling of outside light, the power consumption and temperature control, optimizing the interconnection network structure and routing algorithm.

关 键 词：片上光互连 3D 光互连网络 微环谐振器 高速数据传输 

分 类 号：TN491[电子电信—微电子学与固体电子学] TN929.1