影响Cu-Sn合金电阻率的因素  

The Factors Affecting the Resistance of Cu-Sn Alloys

作　　者：王宥宏[1] 马健凯 杨雨潭 张俊婷[1] 李秋书[1] 

机构地区：[1]太原科技大学材料科学与工程学院,太原030024

出　　处：《材料导报（纳米与新材料专辑）》2014年第1期400-402,409,共4页

摘　　要：利用量子力学理论分析了成分变化对Cu-Sn合金电阻率影响的微观机理;探讨了铸态、正火态、轧制态和回火态存在的一些影响因素,如固溶体中的溶质含量、晶界、晶体缺陷和应力等对Cu-Sn合金电阻率影响的宏观机理。实验结果表明:正火处理会增加Sn原子在Cu晶粒内部的固溶量,使合金的电阻率上升;大变形量轧制后,Cu晶粒被挤压变长,晶界厚度减小,铸造缺陷基本消失,自由电子被散射的几率减小,Cu-Sn合金的电阻率会大幅度下降;回火处理可消除微观组织中的部分应力,使晶格畸变减轻和位错密度降低,可获得更低的电阻率。The micro-mechanism of the resistance change affected by compositional variation of Cu-Sn alloys is analyzed by quantum-mechanical theory. The macro-mechanism of the resistance change of Cu-Sn alloys affected by different process factors in cast state, normalization state, rolling state and temper state, as the solute content in solution, the grain boundary, the crystal defect and stress, ere, is discussed. The results showed that the solute content of Sn in Cu grain was increased by normalization, which made the resistance go up; after large deformation rolling, the Cu grain was squeezed to long column, its grain boundary thickness was decreased and the casting defects basically disappeared, the scattering probability for free electrons was decreased, so the resistivity of Cu-Sn alloys can drop drastically; a part of stress in microstrueture can be eliminated by tempering treatment, which made the lattice distortion relieved and the dislocation density decreased, so the lower resistivity can be obtained.

关 键 词：Cu-Sn合金 电阻率 热处理 轧制 

分 类 号：TF125.211[冶金工程—粉末冶金]