电沉积纳米金属多层膜研究  

STUDY ON ELECTRODEPOSITING NANOSTRUCTURE MULTILAYERS

作　　者：姚素薇[1] 桂枫[1] 张卫国[1] 冯钊永[1] 窦升鹏[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《天津大学学报（自然科学与工程技术版）》2001年第2期261-264,共4页Journal of Tianjin University：Science and Technology

基　　金：国家自然科学基金资助项目

摘　　要：分别采用单槽法和双槽法电沉积制备 Cu/ Ni多层膜 .研究了两种电沉积方法制备多层膜的工艺条件 ,并利用俄歇电子能谱和扫描电子显微镜 (SEM)确定镀层结构 .通过对比 。In this paper Cu/Ni multilayers were prepared by using single-bath and double-bath methods respectively.The technological conditions were studied,and the multilayer structure was studied by using Auger and SEM.In addition,on the basis of experiment,the single-bath and double-bath methods were compared.

关 键 词：电沉积 金属多层膜 纳米结构 铜/镍多层膜 单槽法 双槽法 组分调制合金 

分 类 号：TB383[一般工业技术—材料科学与工程] TG174.44[金属学及工艺—金属表面处理]