枪黑色Ni-Sn合金镀液的稳定性及金属杂质的影响  

Stability of Gun Color Ni-Sn Plating Bath and Effects of Metal Impurities

作　　者：熊友泉[1] 

机构地区：[1]南昌航空工业学院,330034

出　　处：《材料保护》2001年第3期25-26,34,共3页Materials Protection

摘　　要：测定了以羟基羧酸盐作配体的电镀枪黑色Ni Sn合金的碱性溶液各组分的自然消耗和生产性消耗 ,确定了镀液中能够抑制Sn2 + 氧化的稳定剂 ,制定了清除镀液中Zn2 + 、Fe2 + 和Cu2 + 等金属杂质的电解方法。结果表明 ,亚锡盐的自然消耗是引起镀液自然静置时不稳定的唯一因素 ;镀液生产性消耗 ,亚锡盐下降率最大 ,镍盐最小 ;以小电流电解可除去Zn2 + 、Fe2 + 和Cu2 + 杂质。The spontaneous and productive consuming of the components in alkaline bath solution for gun color Ni Sn plating when using hydroxy carboxy late as complex agent was studied.It was shown that the spontaneous consume of Sn 2+ could be the unique factor leading the bath solution unstable,and the Sn 2+ was reduced much more than Ni 2+ in productive consuming.The Zn 2+ ,Fe 2+ and Cu 2+ impurities could be moved out from the solution by electrolylic method.

关 键 词：枪黑色电镀 镍锡合金 镀液 稳定性 金属杂质 

分 类 号：TQ153.2[化学工程—电化学工业]