Sn-Pb共晶钎料合金的Bodner-Partom本构方程  

Viscoplastic Constitutive Equations for TinLeadEutectic Solder Alloy

作　　者：马鑫[1] 王莉[1] 方洪渊[1] 钱乙余[1] 

机构地区：[1]哈尔滨工业大学

出　　处：《应用力学学报》1998年第2期87-90,共4页Chinese Journal of Applied Mechanics

摘　　要：采用Ｂｏｄｎｅｒ－Ｐａｒｔｏｍ粘塑性本构理论研究了Ｓｎ－Ｐｂ共晶合金的本构方程。在应变速率１０－５—１０－２Ｓ－１、温度为－５５—１２５℃的外部变量范围内进行了单轴拉伸和稳态蠕变数值模拟，结果与实验吻合良好。同时讨论了该本构方程用于ＳＭＴ焊点热循环寿命预测的实际意义。odnerPartom viscoplastic constitutive theory was used to study the constitutive equations of Sn60Pb40 eutectic solder alloy. The deformation phenomena associated with the solders montonic and steadystate creep response were accurately predicted for 10-5S-1≤ε≤10-2S-1　and -55℃≤T≤125℃.　The realistic meaning of using this constitutive equations for life predicting of SMT solder joint under thermomechanical cycle conditions is also discussed.

关 键 词：本构方程 粘塑性 数值模拟 钎料 锡-铅共晶合金 

分 类 号：TG425.1[金属学及工艺—焊接]