添加Sm_2O_3的AlN陶瓷的显微结构和导热性能  

MICROSTRUCTURE AND THERMAL CONDUCTIVITY OF AIN CERAMICS WITH THE ADDITION OF Sm_2O_3

作　　者：许昕睿[1] 庄汉锐[1] 徐素英[1] 李文兰[1] 邬凤英[1] 

机构地区：[1]中国科学院上海硅酸盐研究所,上海市200050

出　　处：《材料研究学报》2001年第3期313-317,共5页Chinese Journal of Materials Research

基　　金：国家自然科学基金重点资助项目 69836030

摘　　要：以自蔓延高温合成方法（ＳＨＳ）制备的并经抗水化处理的ＡｌＮ粉体为原料，研究了埋粉条件对添加 Ｓｍ２Ｏ３的ＡｌＮ陶瓷显微结构和导热性能的影响．结果表明，在不加埋粉烧结条件下试祥周围的还原性气氛增强有助于形成较高Ｓｍ／Ａｌ比的晶界相，不加埋粉有利于晶界相的排出这些因素均有助于提高ＡｌＮ陶瓷的热导率不加埋粉在Effects of packing powder on microstructure and thermal conductivity of Sm2O3doped AIN ceramics were studied, with anti--hydrolysis AIN powder as raw material, which was synthesized by SHS method. The results showed that the kind, amount and distribution of secondary phase were affected by the packing powder condition. When AIN samples were sintered without packing powder, the reducing atmosphere surrounding with AIN samples was so increased that it was easy to produce secondary phase with high Sm/Al ratio, and sintering without packing powder also benefited for the removal of secondary phase from the sample's inside to surface. Therefore. sintering without packing powder is an effective method to improve the thermal conductivity. Under the condition of sintering at 1830 ℃ without packing powder, AIN ceramic with thermal conductivity of 166W/(m.K) is obtained.

关 键 词：埋粉条件 显微结构 热导率 导热性能 氮化铝陶瓷 氧化钐 

分 类 号：TQ174.758[化学工程—陶瓷工业] TQ174.1[化学工程—硅酸盐工业]