片式元器件与SMT技术新进展  

The Advance in Chip Components and SMT

作　　者：向勇[1] 谢道华[1] 张昊[1] 

机构地区：[1]天津大学电子信息工程学院,天津300072

出　　处：《电子工艺技术》2001年第3期93-95,共3页Electronics Process Technology

摘　　要：综述了片式元器件与SMT技术的最新发展动态。重点讨论了现代信息产业全面促进电容类、电阻类、电感类片式元器件在体积微型化。The new advance in chip components and surface mounted technology (SMT) are summarized all over the world.The development is discussed that chip components size is on the decrease,including chip capacitors,resistors,inductors,due to modern IT and electronics industry demand.And it is focused that new chip trimmer components.

关 键 词：片式元器件 SMT 电子元器件 

分 类 号：TN603.5[电子电信—电路与系统]