玻璃与可阀合金的电场辅助阳极连接  

Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy

作　　者：陈铮[1] 池内建二[2] 高桥诚[2] 西川聪[2] 

机构地区：[1]华东船舶工业学院,镇江212003 [2]大阪大学接合科学研究所

出　　处：《焊接学报》2001年第4期21-25,共5页Transactions of The China Welding Institution

基　　金：国防基础研究基金资助项目 ( 99J43.3.13) ;日本大阪大学奖学金资助

摘　　要：在施加电压为 5 0 0V、连接温度为 613K的条件下 ,进行了玻璃与可阀合金的电场辅助阳极连接 ,用扫描电镜和电子探针对连接界面进行了观察和分析 ,测定了接头的剪切强度。结果表明 ,玻璃与可阀之间的紧密接触面积随连接时间的延长从初始接触区域开始逐步扩大。玻璃中的Na、K离子在电场作用下不断从阳极向阴极迁移 ,在靠近阳极表面处形成它们的耗尽层 ,耗尽层宽度亦随连接时间延长而增大。只要玻璃与可阀之间达到近 10 0 %的紧密接触和连接 ,连接接头即可达到稳定的强度 ,平均为 8～ 12MPa。对上述试验结果从理论上进行了分析和讨论。Electric field-assisted anodic bonding of glass to Kovar alloy was preformed at 613 K under an applied voltage of 500 V. The interfaces were investigated by SEM observation and EPMA analyses. In order to determine the joint strength, shear tests were carried out. The results show that the intimately contacted area between Kovar alloy and the glass enlarges from initial contact area with the increase of bonding time. Na and K ions involved in the glass move toward the cathode from the anode surface under the action of electric field, forming depleted layers near the adjacent anode surface. The thickness of depleted layers also increases with the increase of bonding time.

关 键 词：阳极连接 电场力 紧密接触 离子迁移 界面反应 连接强度 玻璃 可阀合金 

分 类 号：TG456.9[金属学及工艺—焊接]