甲基四氢苯酐中温固化低粘环氧树脂体系研究  

Study on the Moderate Temperature Curing System of Methyltetrahydrophthalic Anhydride-Lower Viscosity Epoxy Resin

作　　者：吴健伟[1] 于昕[1] 付刚[1] 匡宏[1] 付春明[1] 

机构地区：[1]黑龙江省石油化学研究院,黑龙江哈尔滨150040

出　　处：《化学与粘合》2001年第4期160-161,167,共3页Chemistry and Adhesion

摘　　要：本文研究了甲基四氢苯酐中温固化低粘环氧树脂TDE - 85的基本配方和固化条件 ,并着重研究了适用于该体系的促进剂 ,发现促进剂D(金属有机络合物 )对该体系有较好的适用性 ,使其具有较长的使用期 (室温 >2 0天 )和较高的中温固化活性 ,固化物具有良好的耐热性。The accelerator for the moderate temperature curing system of methyltetrahydrophthalic anhydride/TDE-85 was studied,and the basic formula and curing conditions were discussed.It was found that the system catalyzed by accelerator D(metal organic chelate)had a long pot life and high curing activity and the cured product showed good heat resistance.This system could be used in prepregging,filament winding and resin transfer molding(RTM).

关 键 词：甲基四氢苯酐 TDE-85 促进剂 固化 环氧树脂 胶粘剂 

分 类 号：TQ433.437[化学工程]